From concept sketch to retail-ready product. Every discipline under one roof: acoustics, electronics, industrial design, firmware, app, packaging, and compliance.
A proven 8-stage process refined over 500+ product launches. Typical cycle: 8-16 weeks from brief to mass production.
You share your vision: target market, price point, feature set, and reference competitors. Our engineering team maps it to available platforms and identifies any R&D gaps. We return a feasibility report with BOM cost estimate and development timeline within 3 business days.
Our ID team produces 2-3 concept directions: sketches, CMF (Color/Material/Finish) proposals, and rough 3D renders. We iterate based on your feedback. Once locked, we proceed to 3D CAD for tooling.
Schematic capture and PCB layout based on the chosen platform (Qualcomm, Realtek, BES, or Airoha). Antenna tuning, power management design, and connector placement. First PCBA samples fabricated in our Shenzhen facility.
3D-printed or soft-tooled enclosures loaded with driver candidates. Measurements in our anechoic chamber using Audio Precision APx525. A/B listening panels. Iterate until the sound signature matches your brand identity.
Bluetooth stack integration, ANC filter tuning, touch UI logic, and companion app development (iOS + Android). OTA firmware update infrastructure. Voice assistant integration if applicable.
Hard tooling for plastics, metal parts, and silicone. First off-tool samples assembled and subjected to engineering validation: drop tests, waterproofing, button cycle testing, antenna OTA performance.
Pilot run of 50-200 units. Full certification suite: FCC (USA), CE (EU), Bluetooth SIG qualification, RoHS, REACH. Packaging validation including drop and transit testing. Golden samples approved by you.
Production validation run on the final assembly line. Process capability studies, AQL inspection protocol established. Full production ramp. FOB Shenzhen or delivered duty paid to your warehouse.
Our in-house acoustic lab is the heart of every product we ship. Every driver, every enclosure, every DSP profile is measured and validated here.
Custom-built anechoic chamber with <20dB ambient noise floor. Full 360-degree speaker rotation turntable for polar response measurements. Gated sine sweep, MLS, and log-chirp excitation methods. All measurements IEC 60268-5 compliant.
The industry-standard audio analyzer. 2-channel analog + 8-channel digital I/O, 192kHz sample rate. THD+N measurements down to -120dB. Full suite: frequency response, distortion, crosstalk, SNR, dynamic range, jitter analysis. The same machine used by every major audio brand's R&D lab.
The difference between a returned product and a 5-star bestseller is the tuning. We offer multiple target curves and can match any reference product's sound signature.
The most scientifically-validated headphone target curve, preferred by ~64% of listeners in blinded studies. We tune to the latest Harman IE/OE targets and can adjust the bass shelf and treble tilt per your brand's house sound.
Your brand may have a signature sound: bass-forward for gaming, flat-reference for studio monitors, or V-shaped for consumer headphones. We build DSP filters (FIR/IIR) to hit your exact target and validate with both measurements and expert listening panels.
Hybrid ANC performance depends on precise filter design. We tune feedforward and feedback filters for max depth at target frequencies. Typical performance: 40-45dB broadband ANC depth with low occlusion effect. Transparent/ambient mode also tuned for natural pass-through.
Environmental Noise Cancellation for voice calls uses multi-mic beamforming. We optimize for voice pickup clarity in wind, traffic, cafe, and office noise environments. 3GPP/ETSI test suite compliance for carrier-grade products.
We work across all major Bluetooth audio SoC platforms. Choose the right silicon for your price point and feature set.
| Vendor | Key Chipsets | Best For | Key Features |
|---|---|---|---|
| Qualcomm | QCC5181QCC3086QCC3071 | Flagship TWS, premium headphones, hi-res DACs | aptX Lossless, Snapdragon Sound, Adaptive ANC, LE Audio / Auracast, multipoint |
| Realtek | RTL8763ERTL8773CRTL8762D | Mid-range TWS, Bluetooth speakers, soundbars | ANC, ENC, low power, cost-optimized, good SDK maturity |
| BES | BES2700BES2600ZBES2500 | Value TWS, OWS / open-ear, wearable audio | Adaptive ANC, spatial audio, low BOM cost, strong in China ecosystem |
| Airoha | AB1568AB1565AB1588 | Entry/mid TWS, Bluetooth speakers, gaming audio | Low latency gaming mode, ANC, ENC, competitive pricing |
Tell us about your product vision. We'll respond with a feasibility study, reference BOM pricing, and a sample timeline.